| 3. | With the development of microelectronic products ( integrated circuit , printed circuit board , etc ) directing to high density , thin separation and low defect ratio , its inspection requirement is higher on aspects of precision , efficiency , universal , and intelligence etc . therefore , this paper researched on the general key techniques in the field of microelectronic products vision inspection , covered the shortage of traditional inspection on aspects of fast and precision locating , image mosaic , and fine defect test , completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision , developed the prototype and used lots of experiments to prove its correctness and feasibility
随着微电子产品(集成电路芯片、印刷电路板等)向着高密度、细间距和低缺陷方向发展,对其检测技术在精密、高效、通用和智能化等方面提出了更高要求。由此,本文对微电子产品视觉检测中的关键技术进行研究,弥补了传统检测在精确快速定位、图像全景组合和精细缺陷检测等方面的不足,最终完成基于机器视觉的微电子产品外形尺寸和缺陷检测的理论研究和样机研制,并进行了大量实验证明其正确性和可行性,力图为我国自主创新的微电子产品视觉检测技术提供理论和实际借鉴。 |
